Part Number Hot Search : 
XXXXXX CMPZ4615 MT48LC8 1206C 16JT1 12018 USTB1 SII9226
Product Description
Full Text Search
 

To Download H1563S Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HP200201 HS200207 Issued Date : 2000.10.01 Revised Date : 2002.07.12 Page No. : 1/8
H1563P / H1563S
HIGH-EFFICIENCY DC/DC CONVERTER
Description
The H1563 is a monolithic control circuit containing the primary functions required for DC to DC converters and highside-sensed constant current source. The device consists of an internal temperature compensated reference, comparator, controlled duty cycle oscillator with an active current sense circuit, bootstrapped driver, and high current output switch. This device is specifically designed to construct a constant current source for battery chargers with a minimum number of external components. Bootstrapped driver can drive the NPN output switch to saturation for higher eff-iciency and less heat dissipation. The H1563 can deliver 1.5A continuous current without requiring a heat sink.
Features
* 3V to 40V Input Voltage Operation * Internal 2A Peak Current Switch * 1.5A Continuous Output Current * Bootstrapped Driver * High Side Current Sense Capability * High Efficiency (up to 90%) * Internal 2% Reference * Low Quiescent Current at 1.6mA * Frequency Operation from 100Hz to 100KHz
Applications
* Constant Current Source for Battery Chargers * Saver for Cellular Phone * Step-Down DC-DC Converter Module
Typical Application Circuit
Saver Circuit for Cellular Phone
R1 1K D2 R2 120 C3 1uF L 220uH D1 H1N5821 SC SE + C1 220uF CT 470pF TC GND BST IS VCC RB FB RA 5.6K 33K H1563 + D3 *RS H1N5819 Co 220uF Io
H1N4148 Vin
C5 10uF
+
*Io=300mV/RS
H1563P / H1563S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Pin Connections
Order No. H1563P (Plastic DIP) H1563S (Plastic SO) Top View
8 7 6 5
Spec. No. : HP200201 HS200207 Issued Date : 2000.10.01 Revised Date : 2002.07.12 Page No. : 2/8
Pin1: SC-2A Switch Collector Pin2: SE-Darlington Switch Emitter Pin3: TC-Oscillator Timing Capacitor
Pin5: FB-Feedback Comparator Inverting Input Pin6: VCC-Power Supply Input Pin7: IS-Highside Current Sense Input Pin8: BST-Bootstrapped Driver Collector
1
2
3
4
Pin4: GND-Power Ground
Block Diagram
1 SC Q Q2 CT 80 Oscillator 1.25V Reference Voltage + Comparator 5 FB 6 8 BST
S R 7 IS Is
Q1 SE 2
3 TC GND 4
VCC
Absolute Maxium Rating
Rating Symbol Power Supply Voltage Vcc Comparator Input Voltage Range Vir Switch Collector Voltage Vc(switch) Switch Emitter Voltage (Vpin1=40V) Ve(switch) Switch Collector to Emitter Voltage Vce(switch) Driver Collector Voltage Vc(driver) Switch Current Isw Operating Junction Temperature Tj Operating Ambient Temperature Range Ta Storage Temperature Range Tstg DIP Package Power Dissipation and Thermal Characteristics: Ta=25C Thermal Resistance SO Package Power Dissipation and Thermal Characteristics: Ta=25C Thermal Resistance Value 40 0.3 ~ +40 40 40 40 40 2 150 0 to +70 -65 to +150 1.5 85 1.2 105 Unit Vdc Vdc Vdc Vdc Vdc Vdc A C C C W C/W W C/W
H1563P / H1563S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Test Circuit
R1 VCC 1K
Spec. No. : HP200201 HS200207 Issued Date : 2000.10.01 Revised Date : 2002.07.12 Page No. : 3/8
1A Current Source
1 2 3
SC SE TC GND
BST IS VCC FB
8 7 6 5
20mA Current Source 4.55V @VCC=5V 4.75V
VCC 1.275V 1.225V
2V/0V IDISCHG /ICHG CT 1nF
4
H1563
Characteristics Curve
Standby Supply Current vs Supply Voltage
2 1.3
Vfb Theshold Voltage vs Temperature
1.6
1.28
Vfb Threshold Voltage (V)
Icc Supply Current (mA)
1.2
1.26
0.8
1.24 VCC=5V Ct=1nF PIN2=GND 1.22
0.4
0 0 5 10 15 20 25 30 35 40
1.2 0 10 20 30 40 50 60 70 80
Vcc Supply Voltage (V)
Temperature (J)
Common Emitter Configuration Output Switch Saturation Voltage vs Collector Current
1 1.8
Emmiter Follower Configuration Output Switch Saturtion Voltage vs Emmiter Current
Vce(sat) Saturation Voltage (V)
0.8
0.6
VCC=5V PIN7=VCC PIN2,3,5=GND
Vce(sat) Sarurtion Voltage (V)
1.7
1.6 VCC=5V PIN1,7,8=VCC PIN3,5=GND
Forced Beta=20 0.4
1.5
1.4
0.2
1.3
0 0 0.5 1 1.5 2
1.2 0 0.5 1 1.5 2
Ic Collector Current (A)
Ie Emitter (A)
H1563P / H1563S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Electrical Characteristics (Vcc=5V, Ta=25C, unless otherwise specified)
Parameter Oscillator Charging Current Discharge Current Voltage Swing Discharge to Charge Current Ratio Current Limit Sense Voltage Output Switch Saturation Voltage, Emitter Follower Connection Saturation Voltage DC Current Gain Collector Off-State Current Comparator Threshold Voltage Threshold Voltage Line Regulation Input Bias Current Supply Current 5VVCC40V 5VVCC40V Pin3 VIS =VCC IChg=Idischg Ichg Idischg VOSC IDischg/Ichg VCC-VIS 24 140 250 Test Condition Symbol
Spec. No. : HP200201 HS200207 Issued Date : 2000.10.01 Revised Date : 2002.07.12 Page No. : 4/8
Min.
Typ. Max. 35 220 0.6 6 300 42 260 350
Unit uA uA V mV
ISE=1A, VBST=VSC=VCC ISC=1A, IBST=50mA (Forced 20) ISC=1A, VCE=5V VCE=30V Ta=25C 0CTa70C 3VVCC40V VIN=0V VIS=VCC, VPin5>VFB 5VVCC40V, CT=1nF Pin2=Gnd Remaining pins open
VCE(Sat) VCE(Sat) hFE ICC(Off)
35 -
1 0.4 120 10
1.3 0.7 -
V V nA V V mV nA mA
VFB REGLine IIB ICC
1.227 1.25 1.273 1.21 1.29 3 6 20 400 1.6 3
Application Information
Design Formula Table
Calculation ton / toff (ton+toff) max CT IC(switch) RS L(min) CO Step-Down Vout+VF / (Vin(min) -Vsat-Vout) 1 / Fmin 4*10-5ton 2*Iout(max) 0.3 / IC(switch) ((Vin(min)-Vsat-Vout) / IC(switch))*ton(max) IC(switch)*(ton+toff) / 8VRipple(P-P) Step-Up Vout+VF-Vin(min) / (Vin(min)-Vsat) 1 / Fmin 4*10-5ton 2*Iout(max)*(ton+toff / toff) 0.3 / IC(switch) ((Vin(min)-Vsat) / IC(switch))*ton(max)
Iout*ton / VRipple(P-P)
Vsat: Saturation voltage of the output switch. VF: Forward voltage of the ringback rectifier. The following power supply characteristics must be chosen: Vin: Nominal input voltage. Vout: Desired output voltage. |Vout|=1.25*(1+RB/RA) Iout: Desired output current Fmin: Minimum desired switching frequency at selected values for Vin and Iout. VRipple(P-P): Desired peak to peak output ripple voltage in practice, the calculated value will need to be increased due to the capacitor equivalent series resistance and board layout. The ripple voltage should be kept to a low value since it will directly effect the line and load regulation.
H1563P / H1563S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Application Information (Continuos)
Fig.1 Step-Down Converter
R1 470 D2 C3
+
Spec. No. : HP200201 HS200207 Issued Date : 2000.10.01 Revised Date : 2002.07.12 Page No. : 5/8
D3 1N1418 L1 300uH D1 H1N5819
8
5V/1A
H1N4148
1uF
+
C4 470uF
RS 0.22 Vin 8V~25V + C1 100uF
BST IS VCC FB
SC SE TC GND
1 2 3 4
7 6 5
R2 390K
RB C2 1000pF RA 1K 3K
H1563 R3 2.2M
Line Regulation: 40mV (Vin=10V~20V, @Io=1A) Load Regulation: 20mV (Vin=15V, @Io=100mA~1A) Short Circuit Current: 1.3A (Vin=15V, @RL=0.1)
Fig.2 Step-Down Converter With External 5V Bootstrap
D2 5V H1N4148 C3
+
L1 300uH D1 H1N5819 + C4 470uF
12V/1A
1uF
8
RS 0.22 Vin 16V~25V + C1 100uF
BST IS VCC FB
SC SE TC GND
1 2 3 4
7 6 5
RB C2 470pF 13K RA 1.5K
H1563
Fig.3 Step-Up Converter
L 200uH H1N5819 R1 150
8 1 2 3 4
D1
Vout 28V/200mA + Co 220uF
RS 0.22 Vin + C1 100uF RA 2.2K
BST IS VCC FB
SC SE TC GND
7 6 5
CT 680pF RB 47K
H1563
Line Regulation: 100mV (Vin=8V~16V, @Io=200mA) Load Regulation: 40mV (Vin=12V, @Io=80mA~200mA)
H1563P / H1563S HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HP200201 HS200207 Issued Date : 2000.10.01 Revised Date : 2002.07.12 Page No. : 6/8
Fig.4 Step-Up Converter With External NPN Switch
Vout L D1 R1
8
+ Q1
Co
BST IS VCC FB
SC SE TC GND
1 2 3 4
RS Vin + C1 RA
7 6 5
R2 CT RB
H1563
Fig.5 Inverting Converter
8
RS 0.25 Vin 4.5V~6V + C1 100uF
BST IS VCC FB
SC SE TC GND
1 2 3 4
7 6 5
H1563 RB 8.2K RA 953
CT 600pF
L 100uH
D1 H1N5819
Vout Co 470uF -12V/100mA
Line Regulation: 20mV (Vin=4.5V~6V, @Io=100mA) Load Regulation: 100mV (Vin=5V, @Io=10mA~100mA)
H1563P / H1563S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
H1563P Dimension (DIP-8P)
Spec. No. : HP200201 HS200207 Issued Date : 2000.10.01 Revised Date : 2002.07.12 Page No. : 7/8
Marking:
8 7 6 5 A 1 2 B 3 4 J F
DIP-8P Plastic Package HSMC Package Code: P
H 15 6 3 P
Date Code
C
E DH
G M
1 K
I
L
*: Typical
DIM A B C D E F G
Inches Min. Max. 0.2480 0.2520 0.3630 0.3670 *0.0600 *0.0500 *0.0390 0.1280 0.1320 0.1250 0.1400
Millimeters Min. Max. 6.29 6.40 9.22 9.32 *1.52 *1.27 *0.99 3.25 3.35 3.17 3.55
DIM H I J K L M 1
Inches Min. Max. 0.0150 0.0210 0.0898 0.1098 0.2950 0.3050 *0.1181 0.3370 0.7470 0.0090 0.0150 94 97
Millimeters Min. Max. 0.38 0.53 2.28 2.79 7.49 7.74 *3.00 8.56 8.81 0.229 0.381 94 97
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
* Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
H1563P / H1563S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
H1563S Dimension (SOP-8P)
Top View A Right side View G
Spec. No. : HP200201 HS200207 Issued Date : 2000.10.01 Revised Date : 2002.07.12 Page No. : 8/8
Marking:
I B C H
H 15 6 3
S
Date Code
J D Front View
Part A
SOP-8P Plastic Package HSMC Package Code: S
E
Part A
K L N O
M
F
*: Typical
DIM A B C D E F G H
Inches Min. Max. 0.1909 0.2007 0.1515 0.1555 0.2283 0.2441 0.0480 0.0519 0.0145 0.0185 0.1472 0.1527 0.0570 0.0649 0.1889 0.2007
Millimeters Min. Max. 4.85 5.10 3.85 3.95 5.80 6.20 1.22 1.32 0.37 0.47 3.74 3.88 1.45 1.65 4.80 5.10
DIM I J K L M N O
Inches Min. Max. 0.0019 0.0078 0.0118 0.0275 0.0074 0.0098 0.0145 0.0204 0.0090 0.0110 0.0031 0.0051 0.0000 0.0059
Millimeters Min. Max. 0.05 0.20 0.30 0.70 0.19 0.25 0.37 0.52 0.23 0.28 0.08 0.13 0.00 0.15
Notes: 1.Dimension and tolerance based on our Spec. dated Mar. 01, 2001.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
* Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
* Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
H1563P / H1563S
HSMC Product Specification


▲Up To Search▲   

 
Price & Availability of H1563S

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X